Technology
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Layer | Specification |
---|---|
PKG Size | 2.6x2.6mm ~ 6.0x6.0mm (Under-develop 10x10mm) |
Chip Size | 1.73x0.97mm ~ 5.0x5.0mm (Under-develop 7x7mm) |
Ball Pitch | ≥0.35mm |
Mold Thickness | 0.30~0.55mm |
Bump Structure | 2P2M (3P3M under-develop by 2022) |