lbsemicon-logo lbsemicon-logo mobile-logo mobile-logo

visual

Technology

우리의 진보된 기술력으로 세상을 더욱 풍요롭게 만듭니다.

SCROLL

Micro Bump

Fine Pitch Micro Bump (Cu/SnAg)
  • wlcsp-01
  • wlcsp-02
  • wlcsp-03
Process Capability
  • Micro Bump
    • 01.
      8inch and 12inch Available
    • 02.
      Target Product
      • Micro-LED
    • 03.
      Micro Bump Development Status
      • 10um Pitch Internally Qualified
    • 04.
      Thick Cu Stack-up Material : Electroplated Cu/Ni/Au
      • Cu for Rs Reduction
      • Ni for Diffusion Barrier
      • Au for Wire Bonding (Au and Cu Wire Bonding Available)
    • 05.
      Micro Bump Material
      • Ni / Lead Free SnAg
Road Map
road map-img

Higher Performance WLCSP

Fine Pitch Micro Bump (Cu/SnAg)
  • wlcsp-01
Features
    • 01.
      HC Series (by Thick RDL and UBM)
      • HCTM 1 (Single RDL)
    • 02.
      Comparison of Jmax
      • Typical WLP (x1)
      • HCTM WLP (x3)

FOWLP

  • wlcsp-01
  • wlcsp-02
  • wlcsp-03
Features
    • 01.
      More Thinner Package Profile (by TB/DB System)
    • 02.
      Higher Reliability (by Full UBM Wetting)
    • 02.
      Higher Current Carrying Capacity (by Thicker RDL & UBM)
Development
    • 01.
      6mm x 6mm size FOWLP Internally Qualified
    • 02.
      Target Product
      • PMIC, RFIC
Package information
Layer Specification
PKG Size 2.6x2.6mm ~ 6.0x6.0mm (Under-develop 10x10mm)
Chip Size 1.73x0.97mm ~ 5.0x5.0mm (Under-develop 7x7mm)
Ball Pitch ≥0.35mm
Mold Thickness 0.30~0.55mm
Bump Structure 2P2M (3P3M under-develop by 2022)
Road Map
road map-img

Flip Chip PKG

  • wlcsp-01
  • wlcsp-02
Features
  • FCCSP
    • 01.
      Flip Chip Chip Scale Package
    • 02.
      Substrate
      • 2~6 Layer Build-up Substrate
    • 03.
      Package Size
      • 3~15mm
    • 04.
      BGA Pitch
      • 0.3~0.8mm
    • 05.
      Bump Type
      • Lead-Free & Cu Pillar Bump
    • 06.
      Capillary Underfill(CUF) & Molded Underfill(MUF) Available
  • FCBGA
    • 01.
      Flip Chip Ball Grid Array
    • 02.
      Substrate
      • 4~8 layer build-up substrate
    • 03.
      Package Size
      • 15~35mm
    • 04.
      BGA Pitch
      • 0.4~1.0mm
    • 05.
      Bump Type
      • Lead-Free & Cu Pillar Bump
    • 06.
      Bare die & thermally enhanced version w/ heat spreader available
처리중입니다