Company
LB Semicon strives for ‘a brand new world’
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LB Semicon Inc. was launched in February 2000 and was the first company in Korea to start a business in the flip-chip wafer bumping field with all necessary production facilities established.
Starting with gold bumping for TFT LCD & OLED Display Driver IC (DDI), LB Semicon Inc. has expanded its scope into Solder bumping, Cu pillar bumping, and even Wafer Level Chip Scale Package (WLCSP) by continuously developing its flip-chip bumping technology. Based on such technological progress, the company has maintained solid partnerships with top semiconductor chip manufacturers both at home and abroad.
As semiconductor chip manufacturers seek to produce increasingly lighter and thinner products, wafer bumping technology is expanding its application scope and creating more value. In order to keep up with this trend, LB Semicon Inc. is deeply committed to continuous research and development, and is steadily advancing towards the goal of becoming the
“Look Beyond, Best Solution Provider.”
Establishment
Feb 10th, 2000Business
SemiconductorTotal Revenue (2021)
496.2 Bill. WonNumber of Employee (2022)
1,001Global Network
7 branches in 4 countries
World No.1
Wafer Bumping through
Probe Test & Back-end
Solution Provider
We promise to do our best to become a company that always provides the best quality.
LB Semicon Inc. is a company that provides Bumping, Probe Test, Back-end, and WLCSP Services for DDI, CIS, PMIC, etc of electronic devices such as TVs, monitors, and mobile phones.
Since the company was established in February 2000, it has developed more advanced technology based on mass production experience accumulated while developing business with leading domestic and overseas semiconductor makers.
LB Semicon Inc. promises to do its best to become a company that always provides the best quality and service so that it can contribute to the reputation of Korea as a world-class semiconductor powerhouse with cutting-edge technology and a challenging spirit that is not afraid of change.
Beyond the Future
2011
Present
Expansion of the test line at Anseong Plant, Korea
Mass-produced SOC / CIS Wafer Test for Samsung Electronics
Fan out WLP Development Completed
Received ISO 45001:2018 Certification
Received IATF 16949:2016 Certification
Acquired LB Lusem
Received Certificate of Excellent Technology Evaluation Enterprise
Designated as Root-technology Specialized Company
Mass-produced High Current WLCSP
Mass-produced Thick Cu
Mass-produced CIS Wafer Test for SK hynix
Mass-produced 12” Au Bump & Solder Bump
Designated as 2011 KDB Global Star
Listed on the KOSDAQ
Received ISO/TS 16949:2009 Certification
Designated as 2010 Deloitte Technology Fast 500 Asia Pacific
Shipped 8" WLCSP Products
Started providing Back-End Service
Mass-produced Solder Bump for CMOS Image Sensor
Changed Corporate Name to LB Semicon
Received ISO 14001:1996 Certification
Awarded US $5 Million Export Tower on the 40th Trade Day
Mass-produced 8" Au Bump for Samsung Electronics
Received ISO 9001:2000 Certification
Mass-produced 8" Wafer Test for Samsung Electronics
Established as a Microscale Corporation Capitalized at KRW 1 Billion
Leaping into the world
2010
2000
Vision
Look Beyond,
Best Solution Provider
Mission
2025, Global OSAT TOP 10
Core Value
ACT(Accompanying, Challenging, Talent)
Promise
Customer, Competitor, Partner company, Employee, Country and Society
You can check out all our products,
made using the world No. 1 technology, at a glance here.
Bump Site 1, 2 / Test Site 3
Overseas Sales Rep.
Sales Office
Information
138, Cheongbuksandan-ro, Cheongbuk-myeon, Pyeongtaek-si, Gyeonggi-do, Republic of Korea
031-680-1600
031-680-1798
Information
10, Gongdan 1-ro, Anseong-si, Gyeonggi-do, Republic of Korea
031-680-1600
031-680-1798
Information
2381 Zanker Road Suite 170 SanJose, CA 95131
+1-408-988-0190
Information
2 Leng Kee Road, #04-03 Thye Hong Centre, Singapore 159086
+65 98628236
Information
Rm. 3, 3F., No.193, Fuxing2nd Rd., ZhubeiCity, HsinchuCounty 302, Taiwan (R.O.C.)
+886 986301677
+86 0755 83496971
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