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지속경영

RoHS RoHS 지침을 준수하고 있는 LB세미콘입니다.

Restriction of Hazardous Substances Directive

LB세미콘㈜은  EU의 RoHS 규제를 준수하고 있으며, 생산하는 모든 제품에 대해서 RoHS, Halogen-free 기준을 충족합니다.
주 1회 XRF Monitoring을 실시하고 있으며, 년 1회 ISO/IEC 17025 인증기관 분석을 진행하고 있습니다.
최종 출하 제품은 납, 수은, 카드뮴, 6가 크롬, PBB, PBDE를 포함하지 않습니다.
Au Plating
Au Bump (Low Hardness) Test Report

Product Name : Au Plating

Item No./Part No. : Au Bump(Low Hardness Bump Wafer Level)

Issued Date : 2019. 09. 20

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Au Plating
Au Bump (High Hardness) Test Report

Product Name : Au Plating

Item No./Part No. : Au Bump(High Hardness Bump Wafer Level)

Issued Date : 2020. 02. 11

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Cu Plating
CU Bump Test Report

Product Name : Cu Plating

Item No./Part No. : Cu Bump (Wafer Level)

Issued Date : 2020. 02. 04

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Ni Bump Test Report
Ni Bump Test Report

Product Name : Ni Bump Test Report

Item No./Part No. : Ni Bump (Wafer Level)

Issued Date : 2020. 02. 04

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SnAg Bump Test Report
SnAg Bump Test Report

Product Name : Snag Plating

Item No./Part No. : Snag Bump (Wafer Level)

Issued Date : 2020. 03. 30

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Solder Ball Test Report
WLCSP Test Report

Product Name : WLCSP Test Report

Item No./Part No. : WLCSP Wafer Level

Issued Date : 2019. 12. 04

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Cu Pillar Bump Test Report
Cupillar Bump Test Report

Product Name : Cupillar Bump Test

Item No./Part No. : Cupillar Bump Wafer Level

Issued Date : 2019. 11. 14

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