제품/기술

• WLCSP
• Bump/RDL
  • Au Bump
  • Solder Bump
  • Cu Pillar Bump
  • Au RDL
  • Thick Cu
• Wafer Test
• Back-end
  • COG
  • WLCSP
• R&D
• COF(LB Lusem)
• 공정 소개 동영상