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Product/Technology

COG

COG

01
Laminating
A process where protective tapes are bonded to the patterned surface to protect the circuit side of a wafer and prevent wafer broken when Wafer Grinding
02
Back Grinding
A process where the backside of the wafer is polished with blade wheels to meet our customers’ needs for low profile and small form factor products
03
Laser Marking
A process where each chip is laser etched with a unique identification code to trace each of them
04
Laser Grooving(Option)
A process where metal TEG is eliminated in scribe lanes
05
SAW
A process where wafers are sliced into individual chips
06
Plasma(Option)
A process where dust particles on wafer surfaces are eliminated using plasma
07
Post AVI
A process where surface demage is inspected after chipping
08
UV Irradiation
A process where the adhesive strength of UV tapes is weakened for a smooth pickup
09
Pick & Place
A process where only good quality chips from wafers that went through a sawing process are selectively transferred to the trays
10
AVI
A process where chips transferred to trays are visually inspected
11
Visual Inspection
A process where the good quality chips transferred to chip carriers or trays are subject to the pass/fail discrimination in accordance with visual inspection standards
12
Packaing
A process where the good quality chips that have gone through the final selection process are subject to a series of packing including vacuum packing, inner packing and outer packing