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Product/Technology

Au Bump

Au Bump

Gold bumped wafers are in general applied on packages such as Tape Carrier Package (TCP), Chip on Glass (COG) and Chip on Film (COF), primarily for consumer products.

This technology was developed as an alternative to the wire bonding technology. The gold bumped chip will be mounted on the package through the thermal compression method.

As demand is increasing for thin and lightweight packages with high I/O and flexible interconnection, these gold bumped wafers will represent a suitable solution for such products as mobile devices.
Application
COF and COG package for TV, Monitor, Notebook DDIC, Mobile, Tablet, Automotive DIC..
Process capability
8inch and 12inch wafer available
Au Bumping process
Various hardness available from 50Hv up to 90Hv
Low level : 50±20Hv
Middle Level : 75±20Hv
High level : 90 ±20Hv
Bump height (typical) : 8 to 16um
Height uniformity
WID : ≤ 2um
WIW : ± 2um
Bump pitch (min) : Straight 21um, Staggered 13um
BOA(bump on active circuit) structure qualified
2D, 3D AOI