About LB Semicon

A company where humans and technology meet

  • About LB Semicon > Company History

About LB Semicon

Company History Here is the history of LB Semicon, which continues to move towards its goal of constant growth.

  • 2019

    01

    FO-WLCSP Under Development

  • 2018

    09

    Received IATF 16949:2016 Certification

  • 05

    Mass-produced WLCSP for Samsung

  • 03

    LB Lusem Acquired

  • 2017

    07

    Received Certificate of Excellent Technology Evaluation Enterprise

  • 05

    Designated as Root-technology Specialized Company

  • 04

    Mass-produced Cu Pillar Bump for SK hynix

  • 2015

    04

    Mass-produced High Current WLCSP

  • 2014

    05

    Mass-produced Thick Cu

  • 04

    Approved Qual for Novatek

  • 03

    Mass-produced WLCSP for Kinetic

  • 2013

    06

    Mass-produced CIS Wafer Test for SK hynix

  • 2012

    08

    Mass-produced 12” Au Bump & Solder Bump

  • 05

    Approved Qual for Himax

  • 2011

    04

    Designated as 2011 KDB Global Star

  • 01

    Listed on the KOSDAQ

  • 2010

    12

    Received ISO/TS 16949:2009 Certification

  • 11

    Designated as 2010 Deloitte Technology Fast 500 Asia Pacific

  • 2009

    12

    Shipped WLCSP Products

  • 04

    Developed WLCSP Process

  • 2008

    01

    Mass-produced COG Pick & Place

  • 01

    Received COG Quality Certification

  • 2007

    12

    Mass-produced Solder Bump for CMOS Image Sensor

  • 2006

    11

    Mass-produced for OKI Semiconductor

  • 10

    Mass-produced for Siliconworks

  • 02

    Mass-produced for MagnaChip

  • 01

    Approved Qual For LG Display

  • 01

    Changed Corporate Name to LB Semicon

  • 2005

    03

    Mass-produced Wafer Test & Au Bump for LG Electronics

  • 01

    Received ISO 14001:1996 Certification

  • 2003

    11

    Awarded US $5 Million Export Tower on the 40th Trade Day

  • 2002

    07

    Mass-produced for Hitachi and Sll (Seiko Instrument Inc)

  • 06

    Mass-produced Au Bump for Samsung Electronics

  • 02

    Received ISO 9001:2000 Certification l Approved Qual for SK hynix

  • 2001

    10

    Completed the Development of Solder Bump

  • 09

    Mass-produced Wafer Test for Samsung Electronics

  • 06

    Completed the Construction of Au Bump Line

  • 2000

    02

    Established as a Microscale Corporation Capitalized at KRW 1 Billion