About LB Semicon

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About LB Semicon

About LB Semicon Welcome to LB Semicon, the company with the world's best technology.

World No.1 Total Package Company
World No.1 Wafer Bumping through Probe Test & Back-end Solution Provider
LB Semicon Inc. was launched in February 2000 and was the first company in Korea to start business in the flip-chip wafer bumping field with all necessary production facilities established.

Starting with gold bumping for TFT LCD & OLED Display Driver IC (DDI), LB Semicon Inc. has expanded its scope into Solder bumping,
Cu pillar bumping, and even Wafer Level Chip Scale Package (WLCSP) by continuously developing its flip-chip bumping technology. Based on such technological process, the company has maintained solid partnerships with top semiconductor chip manufacturers both at home and abroad.

As semiconductor chip manufacturers seek to produce increasingly lighter and thinner products, wafer bumping technology is expanding its application scope and creating more value. In order to keep up with this trend, LB Semicon Inc. is deeply committed to continuous research and development, and is steadily advancing towards the goal of becoming the “Look Beyond, Best Solution Provider.”

Overview

회사 개요 표
Company Name LB Semicon Inc.
Foundation February 2000
Location 138, Cheongbuksandan-ro,
Cheongbuk-eup, Pyeongtaek-si, Gyeonggi-do, South Korea
Phone +82-31-680-1600
Fax +82-31-680 -1798